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  • Monday, May 19, 2014
  • Session 5: Poster Session

    3D ICs in the Real World

    • Dick James, Chipworks Inc. ;
    • Jean-René Raguet, STMicroelectronics ;
    • Laurent Blaya, STMicroelectronics ;
    • Emmanuel Paire, ST Microelectronics

    Advanced FOUP Purge Using Diffusers for FOUP Door-Off Application

    • Huaping Wang, Entegris, Inc. ;
    • Seong Chan Kim, Entegris, Inc. ;
    • Bo Liu, Entegris, Inc. ;
    • William Corbin, G450C - IBM Assignee ;
    • Adrienne Pierce, Edwards Vacuum ;
    • Chris Bailey, Edwards

    Advancement of Microelectronics-Grade Carbon Nanotube Materials for NRAM® Device Manufacture

    • James E. Lamb III, Brewer Science, Inc. ;
    • Stephen Gibbons, Brewer Science, Inc. ;
    • Yongqing Jiang, Brewer Science, Inc. ;
    • Kay Mangelson, Brewer Science, Inc. ;
    • Kathryn Kremer, Brewer Science, Inc. ;
    • Dan Janzen, Brewer Science, Inc. ;
    • John Bledsoe, Brewer Science, Inc. ;
    • Mathew Boeser, Brewer Science, Inc.

    Challenges and Opportunities in Atomistic Dopant Profiling Using Capacitance-Voltage Measurements

    • Samira Aghaei, Florida State University ;
    • Mohit Mehta, Florida State University ;
    • Petru Andrei, Florida State University ;
    • Mark J. Hagmann, NewPath Research L.L.C.

    Correlation Study Of Spatial ESC Temperature Profile and Optical CD/CD SEM measurements to investigate silicon recess and gate CD after Etch

    • John Newby, KLA-Tencor GmbH ;
    • Giampietro Bieli, KLA-Tencor Corp. ;
    • Marcus Wollenweber, KLA-Tencor GmbH ;
    • Robert Melzer, GLOBALFOUNDRIES Fab1 ;
    • Thomas Nogatz, GLOBALFOUNDRIES Fab1 ;
    • Jörg Sobe, GLOBALFOUNDRIES Fab1

    Defect Engineering for Carrier Lifetime Control in High Voltage GaAs Power Diodes

    • Dr. Vladimir A. Kozlov, FID-Technology Ltd. and Power Semiconductors Ltd. ;
    • Dr. Fedor Y. Soldatenkov, Ioffe Institute of Russian Academy of Sciences and Power Semiconductors Ltd. ;
    • Dr. Iren L. Shulpina, Ioffe Institute of Russian Academy of Sciences ;
    • Dr. Valeri G. Danilchenko, Ioffe Institute of Russian Academy of Sciences ;
    • Dr. Vladimir I. Korolkov, Ioffe Institute of Russian Academy of Sciences

    Development of Smart Feature Selection for Advanced Virtual Metrology

    • Benjamin Lenz, Infineon Technologies AG ;
    • Bernd Barak, Infineon Technologies AG ;
    • Carolin Leicht, University Leipzig

    Effective Testing for Wafer Reject Minimization by Terahertz Analysis and Sub-Surface Imaging

    • Anis Rahman, Applied Research & Photonics ;
    • Aunik K. Rahman, Applied Research & Photonics

    Evaluation of FKM / PTFE Hybrid Material Seal

    • Ippei Nakagawa, Nippon Valqua Industries, Ltd.

    Hidden Equipment Productivity Opportunities

    • Jochen Kinauer, AIS Automation Dresden GmbH ;
    • Bert Müller, AIS Automation Dresden GmbH

    Highly-stable Four-point-probe Metrology in Implant and Epitaxy Processes

    • Qing Ye, KLA-Tencor Corp. ;
    • Jianli Cui, KLA-Tencor Corp. ;
    • Lu Yu, KLA-Tencor Corp. ;
    • Tetyana Shapoval, KLA-Tencor Corp. ;
    • Florian Flach, KLA-Tencor Corp. ;
    • Ronny Haupt, KLA-Tencor Corp. ;
    • Franz Heider, Infineon Technologies ;
    • Walter Petersmann, Infineon Technologies ;
    • Martin Haberjahn, Infineon Technologies

    Improvement of Characteristic of Redistribution Layer(RDL)on Mobile Application

    • C.S. Liu, Taiwan Semiconductor Manufacturing Company, Ltd. ;
    • Yu-Nu Hsu, Taiwan Semiconductor Manufacturing Company, Ltd. ;
    • Chyi-Tsong Ni, Taiwan Semiconductor Manufacturing Company, Ltd. ;
    • Ponder Pang, Taiwan Semiconductor Manufacturing Company, Ltd. ;
    • Justin Lo, Taiwan Semiconductor Manufacturing Company, Ltd. ;
    • Wallance Su, Taiwan Semiconductor Manufacturing Company, Ltd. ;
    • Chin-Yu Ku, Taiwan Semiconductor Manufacturing Company, Ltd.

    Improving Yield through Elimination of Nitride Stringers in 180nm EEPROM Process Technology

    • Santosh Menon, ON Semiconductor ;
    • Moshe Agam, ON Semiconductor ;
    • Roger Young, ON Semiconductor ;
    • Peter Cosmin, ON Semiconductor ;
    • Sorin Georgescu, Power Integrations

    Mueller Matrix Optical Scatterometry of Si Fins Patterned using Directed Self-Assembly Block Copolymer Line Arrays

    • Dhairya J. Dixit, College of Nanoscale Science & Engineering ;
    • Alain Diebold, College of Nanoscale Science & Engineering ;
    • Brennan Peterson, Nanometrics Inc. ;
    • Joe Race, Nanometrics ;
    • Manasa Medikonda, College of Nanoscale Science & Engineering

    Multivariate Method for the Monitoring of Etch Chamber Insitu Cleaning

    • Mohamed Boumerzoug, Freescale Semiconductor ;
    • Suradej Promreuk, Freescale Semiconductor

    Novel Metrology and Wafer Grinder Technologies Combine for Improved Capability for TSV Structures

    • Russ Dudley, Rudolph Technologies ;
    • David Grant, Rudolph Technologies ;
    • Thomas Brake, Strasbaugh ;
    • David Marx, Rudolph Technologies ;
    • Rajiv Roy, Rudolph Technologies ;
    • Michael Kirkpatrick, Strasbaugh ;
    • Bill Kalenian, Strasbaugh

    Optical Technologies for TSV Inspection

    • Arun Ananth Aiyer, Frontier Semiconductor ;
    • Nikolai Maltsev, Frontier Semiconductor ;
    • Jaeseok Ryu, Frontier Semiconductor

    People Productivity Improvement via Cloud Machine Monitor

    • Chun-Jung Huang, Taiwan Semiconductor Manufacturing Company Limited ;
    • Yh Chen, Taiwan Semiconductor Manufacturing Company Limited ;
    • CL Wang, Taiwan Semiconductor Manufacturing Company Limited

    Scanning frequency comb microscopy (SFCM): A New Method Showing Promise for High-resolution Carrier Profiling in Semiconductors

    • Mark J. Hagmann, NewPath Research L.L.C. ;
    • Petru Andrei, Florida State University ;
    • Shashank Pandey, University of Utah ;
    • Ajay Nahata, University of Utah

    Screen Printed Flexible Pressure Sensors Skin

    • Saleem Khan, University of Trento ;
    • Leandro Lorenzelli, Fondazione Bruno Kessler ;
    • Ravinder Singh Dahiya, University of Glasgow

    Screening Scenario-based Analysis of Modifications in Planning of Semiconductor Manufacturing

    • Marwa Attiya, Masdar Institute of Science and Technology ;
    • Irfan A. Saadat, Masdar Institute of Science and Technology ;
    • Ali Diabat, Masdar Institute of Science and Technology

    Six Sigma in a Semiconductor Company

    • Karen Riding, GLOBALFOUNDRIES ;
    • Dirk-Alexander Bruedern, GLOBALFOUNDRIES

    Surface Metal Contamination on Tool Components – A Case Study for Evaluating Acid Extraction ICP-MS Measurement Process

    • Shi Liu, ChemTrace Analytical Service ;
    • Bin Liu, ChemTrace Analytical Service

    Uniformity Control for High Selective Down-Flow Plasma Etching on Silicon Oxide

    • Chiu Yuan-Chieh, Macronix International Co., Ltd., ;
    • Fang-Hao Hsu, Macronix International Co., Ltd., ;
    • Lo Kuo-Feng, Macronix International Co., Ltd., ;
    • Lin Xin-Guan, Macronix International Co., Ltd., ;
    • Lee Hong-Ji, Macronix International Co., Ltd., ;
    • Lian Nan-Tzu, Macronix International Co., Ltd., ;
    • Yang Tahone, Macronix International Co., Ltd., ;
    • Chen Kuang-Chao, Macronix International Co., Ltd., ;
    • Lu Chih-Yuan, Macronix International Co., Ltd., ;
    • Chih Yuan Lu, Macronix International Co., Ltd ;
    • Kuang Chao Chen, Macronix International Co., Ltd ;
    • Han-Hui Hsu, Macronix

    Using in-line Film Measurement as a Proxy for Device Matching to Speed up Process Change Qualification

    • Chienfan Yu, IBM Systems and Technology ;
    • Raymond Van Roijen, IBM ;
    • Shailesh Shah, IBM Systems and Technology ;
    • Eric Woodard, IBM Systems and Technology ;
    • Javier Ayala, IBM Systems and Technology ;
    • Edward Sziklas, IBM Systems and Technology