A single link to the first track to allow the export script to build the search page
  • Monday, May 19, 2014
  • Session 3: 3D/TSV

    Successful Void Free Gap Fill of 3µm, High AR Via Middle, Through Silicon Vias at Wafer Level

    • Sarasvathi Thangaraju, GLOBALFOUNDRIES ;
    • Luke England, GLOBALFOUNDRIES ;
    • Mohamed Rabie, GLOBALFOUNDRIES ;
    • Ding You Zhang, GLOBALFOUNDRIES ;
    • Kumarapuram Gopalakrishnan, GLOBALFOUNDRIES ;
    • Richard McGowan, GLOBALFOUNDRIES ;
    • Adam Selsley, GLOBALFOUNDRIES ;
    • Rudraskandan Giridharan, GLOBALFOUNDRIES ;
    • Sipeng Gu, GLOBALFOUNDRIES ;
    • Vijayalakshmi Seshachalam, GLOBALFOUNDRIES ;
    • Chen Wang, GLOBALFOUNDRIES ;
    • Shinichiro Kakita, GLOBALFOUNDRIES ;
    • Sudhir Baral, GLOBALFOUNDRIES ;
    • H. Edmundson, Nanometrics

    Wafer Thinning for High-Density 3D-LSIs _ 12-Inch Wafer Level 3D-Integration at GINTI

    • Mariappan Murugesan, Tohoku University ;
    • Takafumi Fukushima, Tohoku University ;
    • JiChel Bea, Tohoku University ;
    • Hiroyuki Hashimoto, Tohoku University ;
    • Yutaka Sato, Tohoku University ;
    • KangWook Lee, Tohoku University ;
    • Mitsumasa Koyanagi, Tohoku University

    Use of Optical Metrology Techniques for Uniformity Control of 3D stacked IC's

    • Delphine Le Cunff, STMicroelectronics ;
    • Manon Tardif, STMicroelectronics ;
    • Jean-Philippe Piel, FOGALE Nanotech ;
    • Gilles Fresquet, Fogale Nanotech ;
    • Nicolas Hotellier, STMicroelectronics ;
    • Kyoto Le Chao, STMicroelectronics ;
    • Lauren-luc Chapelon, STMicroelectronics ;
    • Pierre Bar, STMicroelectronics ;
    • Stephanie Eynard, STMicroelectronics

    Analysis of TSV Geometric Parameter Impact on Switching Noise in 3D Power Distribution Network

    • Huanyu He, Rensselaer Polytechnic Institute ;
    • Xiaoxiong Gu, IBM T.J. Watson Research Center ;
    • James J.-Q. Lu, Rensselaer Polytechnic Institute

    RF Characterization of Through Silicon Vias Test Structures in a 3-Tier Stacked Wafer

    • Min Xu, University at Albany, State University of New York ;
    • Robert Carroll, University at Albany, State University of New York ;
    • Harika Manem, University at Albany, State University of New York ;
    • Robert Geer, University at Albany, State University of New York

    3D Technology Applications Market Trends & Key Challenges

    • Amandine Pizzagalli, Yole Développement ;
    • Thibault Buisson, Yole Développement ;
    • Rozalia Beica, Yole Développement