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  • Monday, May 19, 2014
  • Benefit of Combining Metrology Techniques for Thin SiGe Layers

    • Delphine Le Cunff, STMicroelectronics ;
    • Thomas Nguyen, STMicroelectronics ;
    • R Duru, STMicroelectronics ;
    • F. Abbate, STMicroelectronics ;
    • Nicolas Laurent, Semilab ;
    • Jonny Hoglund, Semilab ;
    • Matthew Wormington, Jordan Valley Semiconductor ;
    • F. Pernot, Jordan Valley Semiconductor