A single link to the first track to allow the export script to build the search page
  • Monday, May 19, 2014
  • Session 2: Advanced Metrology 1

    Silicon-Germanium (SiGe) Composition and Thickness Determination via Simultaneous Small-spot XPS and XRF measurements

    • Benoit Lherron, STMicroelectronics ;
    • Wei Ti Lee, Revera ;
    • Mark Klare, ReVera ;
    • Heath Pois, Revera ;
    • Mike Kwan, Revera ;
    • Saiqa Farhat, IBM ;
    • Jennifer Fullam, IBM ;
    • John Gaudiello, IBM ;
    • Srinivasan Rangarajan, IBM ;
    • Bing Sun, IBM ;
    • Nicolas Loubet, STMicroelectronics ;
    • Qing Liu, STMicroelectronics ;
    • Romain Wacquez, CEA - LETI ;
    • Sylvian Maitrejean, CEA - LETI ;
    • Tom Larson, Revera ;
    • Ying Wang, Revera ;
    • Emmanuel Augendre, CEA - LETI

    Benefit of Combining Metrology Techniques for Thin SiGe Layers

    • Delphine Le Cunff, STMicroelectronics ;
    • Thomas Nguyen, STMicroelectronics ;
    • R Duru, STMicroelectronics ;
    • F. Abbate, STMicroelectronics ;
    • Nicolas Laurent, Semilab ;
    • Jonny Hoglund, Semilab ;
    • Matthew Wormington, Jordan Valley Semiconductor ;
    • F. Pernot, Jordan Valley Semiconductor

    New Interferometric Measurement Technique For Small Diameter TSV

    • Padraig Timoney, GLOBALFOUNDRIES ;
    • Yeong-Uk Ko, GLOBALFOUNDRIES ;
    • Daniel W. Fisher, GLOBALFOUNDRIES ;
    • Alok Vaid, GLOBALFOUNDRIES ;
    • Sarasvathi Thangaraju, GLOBALFOUNDRIES ;
    • Daniel Smith, GLOBALFOUNDRIES ;
    • Ke Xiao, Nanometrics Inc. ;
    • Tim Johnson, Nanometrics, Inc. ;
    • Holly Edmundson, Nanometrics Inc. ;
    • Wonwoo Kim, GLOBALFOUNDRIES ;
    • Ramakanth Alapati, GLOBALFOUNDRIES ;
    • Himani Kamineni, Globalfoundries ;
    • Dingyou Zhang, Rensselaer Polytechnic Institute ;
    • Nigel Smith, Nanometrics Inc. ;
    • Brennan Peterson, Nanometrics Inc. ;
    • Hemant Amin, Nanometrics, Inc. ;
    • Jonathan Peak, Nanometrics, Inc.

    Ellipsometry for cSiGe Metrology

    • Saiqa Farhat, IBM ;
    • Srinivasan Rangarajan, IBM ;
    • Timothy J. Mcardle, IBM ;
    • Michael Steigerwalt, IBM ;
    • Dawei Hu, KLA-Tencor Corporation ;
    • Ming Dai, KLA-Tencor

    MBIR Characterization of Photosensitive Polyimide in High Volume Manufacturing

    • Taher Kagalwala, IBM ;
    • Jonny Hoglund, Semilab ;
    • Brian Erwin, IBM ;
    • Victoria Calero-DdelC, IBM ;
    • Yuri Brovman, IBM